00954 中信日本半導體 / 融資融券(年)
融資融券統計
| 9/18 資券狀況 | 2026年統計資料 | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
率 | 互抵 | 當沖 | 餘額 | 張數 | 率 | 張數 | 張數 | ||||||||
| 0 | 減→無 | 770 | +977 | +127% | 2,391 (07/29) | 501 (06/12) | |||||||||
| 0 | 0 | 0% | 40 (02/23) | 0 (01/02) | |||||||||||
資券累計增減統計
09/17 ~09/18 | 09/16 ~09/18 | 09/14 ~09/18 | 09/07 ~09/18 | 08/20 ~09/18 | 06/22 ~09/18 | 03/23 ~09/18 | '25/09/19 ~09/18 | |||
|---|---|---|---|---|---|---|---|---|---|---|
(增減幅) | -133 (-7.07%) | -130 (-6.93%) | -59 (-3.27%) | -19 (-1.08%) | +32 (+1.87%) | +741 (+73.66%) | +325 (+22.86%) | +1,576 (+921.64%) | - | - |
(增減幅) | -1 (-100%) | 0 (0%) | 0 (0%) | -2 (-100%) | -3 (-100%) | -2 (-100%) | 0 (0%) | 0 (0%) | - | - |
(增減幅) | 0 (0%) | 0 (0%) | +298 (+9.67%) | +326 (+10.67%) | +314 (+10.24%) | +354 (+11.69%) | -170 (-4.79%) | +35 (+1.05%) | - | - |
| -0.05 | 0 | 0 | -0.11 | -0.17 | -0.2 | 0 | 0 | - | - |
(%) | (千張) | 互抵 (千張) | 當沖 (%) | 比 (%) | 當沖 (%) | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
率% | 率% | |||||||||||||||||||
| 2026 | 556 | 12.3 | 11.1 | 0.21 | +0.99 | 1.75 | 5.54 | 0.12 | 0.12 | 0 | 0 | 0 | 0 | 0.23 | 0.04 | 0 | 7.88 | |||
| 2025 | 376 | 6.08 | 5.63 | 0.04 | +0.41 | 0.77 | 4.35 | 0.05 | 0.05 | 0 | 0 | 0 | 0 | 0.03 | 0.01 | 0 | 4.55 | |||
| 2024 | 263 | 2.49 | 2.13 | 0 | +0.36 | 0.36 | 1.38 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 11.2 | |||

