00954 中信日本半導體 / 融資融券(年)
融資融券統計
| 11/06 資券狀況 | 2026年統計資料 | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
率 | 互抵 | 當沖 | 餘額 | 張數 | 率 | 張數 | 張數 | ||||||||
| 0 | 2增→減 | 770 | +1,330 | +173% | 2,391 (07/29) | 501 (06/12) | |||||||||
| 0 | 0 | 0% | 44 (10/01) | 0 (01/02) | |||||||||||
資券累計增減統計
11/05 ~11/06 | 11/04 ~11/06 | 11/02 ~11/06 | 10/22 ~11/06 | 10/08 ~11/06 | 08/10 ~11/06 | 05/11 ~11/06 | '25/11/07 ~11/06 | |||
|---|---|---|---|---|---|---|---|---|---|---|
(增減幅) | -2 (-0.1%) | +63 (+3.09%) | +124 (+6.28%) | +451 (+27.35%) | +674 (+47.27%) | -63 (-2.91%) | +889 (+73.41%) | +1,279 (+155.79%) | - | - |
(增減幅) | -5 (-100%) | 0 (0%) | 0 (0%) | 0 (0%) | -39 (-100%) | -3 (-100%) | 0 (0%) | -1 (-100%) | - | - |
(增減幅) | -238 (-4.8%) | +387 (+8.94%) | +618 (+15.08%) | +618 (+15.08%) | +1,330 (+39.28%) | +1,649 (+53.77%) | +1,907 (+67.89%) | +1,414 (+42.82%) | - | - |
| -0.24 | 0 | 0 | 0 | -2.73 | -0.14 | 0 | -0.12 | - | - |
(%) | (千張) | 互抵 (千張) | 當沖 (%) | 比 (%) | 當沖 (%) | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
率% | 率% | |||||||||||||||||||
| 2026 | 655 | 14.6 | 13 | 0.22 | +1.35 | 2.1 | 5.55 | 0.19 | 0.19 | 0 | 0 | 0 | 0 | 0.25 | 0.04 | 0 | 8.15 | |||
| 2025 | 376 | 6.08 | 5.63 | 0.04 | +0.41 | 0.77 | 4.35 | 0.05 | 0.05 | 0 | 0 | 0 | 0 | 0.03 | 0.01 | 0 | 4.55 | |||
| 2024 | 263 | 2.49 | 2.13 | 0 | +0.36 | 0.36 | 1.38 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 11.2 | |||

