00954 中信日本半導體 / 融資融券(年)
融資融券統計
| 10/08 資券狀況 | 2026年統計資料 | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
率 | 互抵 | 當沖 | 餘額 | 張數 | 率 | 張數 | 張數 | ||||||||
| 1 | 3減→2增 | 770 | +639 | +83% | 2,391 (07/29) | 501 (06/12) | |||||||||
| 0 | +42 | +0% | 44 (10/01) | 0 (01/02) | |||||||||||
資券累計增減統計
10/07 ~10/08 | 10/06 ~10/08 | 10/02 ~10/08 | 09/23 ~10/08 | 09/09 ~10/08 | 07/13 ~10/08 | 04/10 ~10/08 | '25/10/09 ~10/08 | |||
|---|---|---|---|---|---|---|---|---|---|---|
(增減幅) | -263 (-15.73%) | -256 (-15.38%) | -255 (-15.32%) | -300 (-17.55%) | -203 (-12.59%) | -11 (-0.77%) | +215 (+18.01%) | +903 (+178.46%) | - | - |
(增減幅) | +3 (+7.69%) | +3 (+7.69%) | -2 (-4.55%) | +42 (0%) | +39 (+1300%) | +39 (+1300%) | +42 (0%) | +30 (+250%) | - | - |
(增減幅) | 0 (0%) | 0 (0%) | -50 (-1.46%) | +5 (+0.15%) | +333 (+10.91%) | +219 (+6.92%) | -153 (-4.32%) | +448 (+15.25%) | - | - |
| +0.65 | +0.64 | +0.34 | +2.98 | +2.79 | +2.77 | +2.98 | +0.61 | - | - |
(%) | (千張) | 互抵 (千張) | 當沖 (%) | 比 (%) | 當沖 (%) | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
率% | 率% | |||||||||||||||||||
| 2026 | 581 | 12.7 | 11.9 | 0.21 | +0.66 | 1.41 | 4.73 | 0.13 | 0.17 | 0 | +0.04 | 0.04 | 0.14 | 0.24 | 0.04 | 2.98 | 7.71 | |||
| 2025 | 376 | 6.08 | 5.63 | 0.04 | +0.41 | 0.77 | 4.35 | 0.05 | 0.05 | 0 | 0 | 0 | 0 | 0.03 | 0.01 | 0 | 4.55 | |||
| 2024 | 263 | 2.49 | 2.13 | 0 | +0.36 | 0.36 | 1.38 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 11.2 | |||

