00951 台新日本半導體 / 融資融券(年)
融資融券統計
| 9/18 資券狀況 | 2026年統計資料 | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
率 | 互抵 | 當沖 | 餘額 | 張數 | 率 | 張數 | 張數 | ||||||||
| 2 | 3無→增 | 1,258 | +387 | +30.8% | 2,436 (02/11) | 636 (06/05) | |||||||||
| 1 | +1 | +100% | 1,826 (02/10) | 0 (01/27) | |||||||||||
資券累計增減統計
09/17 ~09/18 | 09/16 ~09/18 | 09/14 ~09/18 | 09/07 ~09/18 | 08/20 ~09/18 | 06/22 ~09/18 | 03/23 ~09/18 | '25/09/19 ~09/18 | |||
|---|---|---|---|---|---|---|---|---|---|---|
(增減幅) | +27 (+1.67%) | +26 (+1.61%) | +16 (+0.98%) | +35 (+2.17%) | +204 (+14.16%) | +709 (+75.75%) | -625 (-27.53%) | +1,155 (+235.71%) | - | - |
(增減幅) | +2 (0%) | +2 (0%) | +1 (+100%) | -2 (-50%) | -1 (-33.33%) | -10 (-83.33%) | -3 (-60%) | -10 (-83.33%) | - | - |
(增減幅) | +465 (+13.08%) | +465 (+13.08%) | +678 (+20.29%) | +616 (+18.1%) | +936 (+30.35%) | +1,168 (+40.95%) | -66 (-1.62%) | -2,821 (-41.24%) | - | - |
| +0.12 | +0.12 | +0.06 | -0.13 | -0.09 | -1.16 | -0.1 | -2.33 | - | - |
(%) | (千張) | 互抵 (千張) | 當沖 (%) | 比 (%) | 當沖 (%) | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
率% | 率% | |||||||||||||||||||
| 2026 | 668 | 13 | 12.5 | 0.13 | +0.38 | 1.64 | 2.7 | 0.43 | 3.4 | 2.97 | +0 | 0 | 0 | 0.16 | 0.02 | 0.12 | 9.83 | |||
| 2025 | 860 | 21.6 | 23.3 | 0.27 | -1.94 | 1.26 | 2.59 | 0.24 | 0.25 | 0.01 | +0 | 0 | 0 | 0.24 | 0.03 | 0.08 | 6.51 | |||
| 2024 | 796 | 16.9 | 13.7 | 0.03 | +3.2 | 3.2 | 3.36 | 0.39 | 0.39 | 0 | 0 | 0 | 0 | 0.46 | 0.06 | 0 | 10.6 | |||

